8 Superconductive Composite Heat Pipes: Features 8 heat pipes with a groove and powder wick structure and dual variable thickness for optimal heat transfer efficiency.
Performance Dual Tower: Dual tower design maximizes surface area and cooling performance with optimized fin density and thickness.
8 Heat Pipe Array: Optimized layout of 8 heat pipes ensures even heat distribution for efficient dissipation across the entire fin area.
Expanded Copper Base: Nickel-plated copper base with expanded surface area for better heat contact and faster conductivity, improving case compatibility.
Dual Mobius Fans: Equipped with dual Mobius fans, providing silent operation without sacrificing cooling performance.
Dual Staggered Fan Setup: A combination of 120mm and 135mm Mobius fans in a staggered Push-Pull configuration maximizes airflow and heat dissipation.
Maximum RAM Clearance: 120mm Mobius fan offers 42mm RAM clearance, ensuring compatibility with a wider range of builds.
All Black Stealth Design: Sleek, premium stealth design with an all-black aluminium top cover and hardware for a clean, modern aesthetic.